National Taiwan University Department of Geosciences, HISPEC LAB
Precision Diamond Wire Saw Workshop
Time：2015.04.20 PM 2:00~4:00
Precision diamond wire saw for cutting sample <12" diameter or square up to 300mm in thickness. It is designed to provide a smooth cutting for many kinds of materials, especially for fragile crystals and TEM or IC sample by using 0.28mm diameter x 15 meter long diamond impregnated wire. It is ideal cutting tool for material research, TEM sample preparation, and IC failure analysis.